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 Pb-Free : Lead Free Soldering for Both SMT and Wave Soldering ( Selective and Conventional ) |
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SMT : Surface Mount Technology ( Capacity 105 million components/month, |
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| down to 0402 chip size, fine pitch 0.4mm, micro BGA ) | ||
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COB : Chip On Board ( 94 million wirebonds/month, operating in clean room class 100,000 ) |
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| FLIP CHIP |
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Flexible Printed Circuit Assembly |
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X-ray Inspection |
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AOI : Automatic Optical Inspection |
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| AIT : Auto Insertion Technology ( Capacity 50 million components/month ) |
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Aqueous Cleaning : Cleaning with De-Ionzed ( DI ) Water |
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ICT :
In-Circuit Testing |
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| FCT : Functional Testing |
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| Burn in Testing : Static Burn in and Dynamic Burn in |
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Complete Product Assembly : Box-Build or Top Level Assembly and Testting |
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| Order Fulfillment Warehousing Service |
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| DFM : Design for Manufacturability |
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| ( fixtures design, ICT & functional tester design, PCB and electronics circuit design ) | ||
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